STM32F103ZET6 MCU Microcontroller Unit IC Chip 32 Bit 512KB Integrated Circuit

STM32F103ZET6 IC Chip MCU 32BIT 512KB FLASH 144LQFP integrated circuit
 
The STM32F103xx is a complete family whose members are fully pin-to-pin, software and feature compatible. In the reference manual, the STM32F103x4 and STM32F103x6 are identified as low-density devices, the STM32F103x8 and STM32F103xB are referred to as medium-density devices and the STM32F103xC, STM32F103xD and STM32F103xE are referred to as high-density devices. Low-density and high-density devices are an extension of the STM32F103x8/B mediumdensity devices, they are specified in the STM32F103x4/6 and STM32F103xC/D/E datasheets, respectively. Low-density devices feature lower Flash memory and RAM capacities, less timers and peripherals. High-density devices have higher Flash memory and RAM capacities, and additional peripherals like SDIO, FSMC, I2S and DAC while remaining fully compatible with the other members of the family. The STM32F103x4, STM32F103x6, STM32F103xC, STM32F103xD and STM32F103xE are a drop-in replacement for the STM32F103x8/B devices, allowing the user to try different memory densities and providing a greater degree of freedom during the development cycle. Moreover, the STM32F103xx performance line family is fully compatible with all existing STM32F101xx access line and STM32F102xx USB access line devices.

Manufacturer	STMicroelectronics
Series	STM32F1
Packaging	Tray
Part Status	Active
Core Processor	ARM® Cortex®-M3
Core Size	32-Bit
Speed	72MHz
Connectivity	CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals	DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number of I/O	112
Program Memory Size	512KB (512K x 8)
Program Memory Type	FLASH
EEPROM Size	-
RAM Size	64K x 8
Voltage - Supply (Vcc/Vdd)	2 V ~ 3.6 V
Data Converters	A/D 21x12b; D/A 2x12b
Oscillator Type	Internal
Operating Temperature	-40°C ~ 85°C (TA)
Package / Case	144-LQFP
Base Part Number	STM32F103